Images | Part Number | Manufacturer | Stock | Package | Description | Inquiry |
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833202B04800 | Comair Rotron | 937 | TO-220 | HEATSINK STAMP 10X21.2X19MM |
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833202B03700 | Comair Rotron | 347 | TO-220 | HEATSINK STAMP 10X21.2X19MM |
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XL25-20-20-2.0 | t-Global Technology | 775 | Assorted (BGA, LGA, CPU, ASIC...) | XL25 CERAMIC BOARD 20X20X2MM |
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XL25-50-50-5 | t-Global Technology | 3,897 | Assorted (BGA, LGA, CPU, ASIC...) | CERAMIC HEAT SPREADER 50X50MM GR |
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XL25-40-40-10-T1-0.25 | t-Global Technology | 3,347 | Assorted (BGA, LGA, CPU, ASIC...) | CERAMIC HEAT SPREADER 40X40MM GR |
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XL25-40-40-3.0 | t-Global Technology | 127 | Assorted (BGA, LGA, CPU, ASIC...) | XL25 CERAMIC BOARD 40X40X3MM |
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695-1B | Wakefield-Vette | 219 | Stud Mounted Diode | HEATSINK FOR STUD MT DIODE BLACK |
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XL25-50-50-10 | t-Global Technology | 3,751 | Assorted (BGA, LGA, CPU, ASIC...) | CERAMIC HEAT SPREADER 50X50MM GR |
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V5229L | Assmann WSW Components | 9,521 | TO-220 | HEATSINK ALUM ANOD |
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XL25-50-50-5-T1-0.25 | t-Global Technology | 3,375 | Assorted (BGA, LGA, CPU, ASIC...) | CERAMIC HEAT SPREADER 50X50MM GR |
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8922 | Aavid, Thermal Division of Boyd Corporation | 9,486 | - | HEAT SINK |
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XL25-50-50-10-T1-0.25 | t-Global Technology | 3,820 | Assorted (BGA, LGA, CPU, ASIC...) | CERAMIC HEAT SPREADER 50X50MM GR |
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320205B00000G | Aavid, Thermal Division of Boyd Corporation | 557 | TO-5 | HEATSINK TO-5 1W H=.25BLK |
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WV-DT2-101E | Ohmite | 2,686 | TO-220, TO-247 (Dual) | HEATSINK DUAL FOR TO-220/247 |
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960-21-12-F-AB-0 | Wakefield-Vette | 8,865 | BGA | HEATSINK 21X12MM FRONT PUSH PIN |
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960-21-15-S-AB-0 | Wakefield-Vette | 5,867 | BGA | HEATSINK 21X15MM SIDE PUSH PIN |
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960-21-15-F-AB-0 | Wakefield-Vette | 7,741 | BGA | HEATSINK 21X15MM FRONT PUSH PIN |
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960-21-15-D-AB-0 | Wakefield-Vette | 6,104 | BGA | HEATSINK 21X15MM DIA PUSH PIN |
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960-21-21-F-AB-0 | Wakefield-Vette | 7,299 | BGA | HEATSINK 21X21MM FRONT PUSH PIN |
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960-19-23-D-AB-0 | Wakefield-Vette | 8,185 | BGA | HEATSINK 19X23MM DIA PUSH PIN |
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