Images | Part Number | Manufacturer | Stock | Package | Description | Inquiry |
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HSE-B20381-040H | CUI Devices | 9,299 | TO-220 | HEAT SINK, EXTRUSION,TO-220, 38. |
Inquiry Now |
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625-35AB | Wakefield-Vette | 7,922 | BGA | HEATSINK FOR 25MM BGA |
Inquiry Now |
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HSE-B18381-035H | CUI Devices | 6,711 | TO-218 | HEAT SINK, EXTRUSION, TO-218, 38 |
Inquiry Now |
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630-35AB | Wakefield-Vette | 9,793 | BGA | HEATSINK FOR 35MM BGA |
Inquiry Now |
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CSM221-12AE | Ohmite | 8,831 | TO-220 | HEATSINK BLACK ANODIZED |
Inquiry Now |
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642-60AB | Wakefield-Vette | 9,779 | BGA | HEATSINK FOR 35MM BGA |
Inquiry Now |
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529901B00000 | Aavid, Thermal Division of Boyd Corporation | 7,399 | TO-218 | BOARD LEVEL HEAT SINK |
Inquiry Now |
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625-35ABT3 | Wakefield-Vette | 7,662 | BGA | HEATSINK FOR 25MM BGA |
Inquiry Now |
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529902B02100G | Aavid, Thermal Division of Boyd Corporation | 6,111 | TO-220 | BOARD LEVEL HEAT SINK |
Inquiry Now |
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HSE-B18635-035H-04 | CUI Devices | 7,572 | TO-218 | HEAT SINK, EXTRUSION, TO-218, 63 |
Inquiry Now |
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642-25ABT3 | Wakefield-Vette | 9,527 | BGA | HEATSINK FOR 35MM BGA |
Inquiry Now |
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533722B02552G | Aavid, Thermal Division of Boyd Corporation | 9,920 | TO-220 (Dual) | HEAT SINK |
Inquiry Now |
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624-60AB | Wakefield-Vette | 6,019 | BGA | HEATSINK FOR 21MM BGA |
Inquiry Now |
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659-65AB | Wakefield-Vette | 5,336 | BGA | HEATSINK EXTRUSION 37MM |
Inquiry Now |
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HSE-B20508-035H-W | CUI Devices | 8,622 | TO-220 | HEAT SINK, EXTRUSION, TO-220, 50 |
Inquiry Now |
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V2136N1-F-LP | Assmann WSW Components | 7,103 | Assorted (BGA, LGA, CPU, ASIC...) | HEATSINK CPU W/ADHESIVE STAMPED |
Inquiry Now |
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HSE-B20635-035H | CUI Devices | 9,648 | TO-220 | HEAT SINK, EXTRUSION, TO-220, 63 |
Inquiry Now |
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HSE-B20635-035H-01 | CUI Devices | 6,931 | TO-220 | HEAT SINK, EXTRUSION, TO-220, 63 |
Inquiry Now |
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V2201N1-F | Assmann WSW Components | 5,711 | Assorted (BGA, LGA, CPU, ASIC...) | HEATSINK CPU W/ADHESIVE STAMPED |
Inquiry Now |
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HSE-B18254-035H-00 | CUI Devices | 14,230 | TO-218 | HEAT SINK, EXTRUSION, TO-218, 25 |
Inquiry Now |
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